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Reliability of Controlled Collapse Interconnections

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2 Author(s)
Norris, K.C. ; IBM Components Division Laboratory, Poughkeepsie, New York, USA ; Landzberg, A.H.

The use of solder pads to join multi-pad integrated circuit chips to modules provides a highly reliable, rugged interconnection technology. This paper reports some important aspects of the reliability evaluation that was carried out on the “controlled chip collapse” interconnection system developed by IBM. Included are an analysis of the mechanics of the system, a model to establish the relationship among different thermal fatigue testing conditions, and experimental verification of the model. In the course of this work, the chip failure rate of the interconnection as used in present designs was predicted to be better than 10−7%/1000 hours for the mechanism studied.

Note: The Institute of Electrical and Electronics Engineers, Incorporated is distributing this Article with permission of the International Business Machines Corporation (IBM) who is the exclusive owner. The recipient of this Article may not assign, sublicense, lease, rent or otherwise transfer, reproduce, prepare derivative works, publicly display or perform, or distribute the Article.  

Published in:

IBM Journal of Research and Development  (Volume:13 ,  Issue: 3 )