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Mechanisms of Stress Relief in Polycrystalline Films

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1 Author(s)
Chaudhari, P. ; IBM Thomas J. Watson Research Center, Yorktown Heights, New York 10598, USA

The stress required to operate dislocation sources within a grain, at a grain boundary, and at surfaces is found to be larger than the intrinsic stresses observed in polycrystalline films. It is therefore unlikely that a dislocation flow mechanism can relieve stresses in films. Grain boundary sliding and diffusional creep can, however, relieve stresses in films and equations describing the kinetics of stress relaxation are derived. It is suggested that stress relief occurs primarily by a diffusion-creep mechanism. Growth of hillocks during annealing of a film is briefly discussed in terms of the diffusion-creep mechanism.

Note: The Institute of Electrical and Electronics Engineers, Incorporated is distributing this Article with permission of the International Business Machines Corporation (IBM) who is the exclusive owner. The recipient of this Article may not assign, sublicense, lease, rent or otherwise transfer, reproduce, prepare derivative works, publicly display or perform, or distribute the Article.  

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IBM Journal of Research and Development  (Volume:13 ,  Issue: 2 )