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Dielectric Films for Ge Planar Devices

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3 Author(s)
T. O. Sedgwick ; IBM Thomas J. Watson Research Center, Yorktown Heights, New York 10598, USA ; J. A. Aboaf ; S. Krongelb

A series of passivating and masking films was developed and evaluated for use in a Ge planar transistor technology. In the search for satisfactory films, silicon dioxide, aluminum oxide, silicon nitride and multilayer combinations of these films, as well as some doped and mixed-composition films, were studied. The films, formed by pyrolytic deposition or by sputtering, were evaluated and compared with respect to the following properties: etch rate; dopant masking; mechanical stress; oxygen, hydrogen and water permeability; stability with respect to elevated temperature electrical-bias stressing; and Ge-insulator interface electrical condition. The most important results of our experiments are the following: Silicon nitride appears to be the only satisfactory mask for Ga diffusions, although silicon dioxide is adequate for As, P and Sb diffusion masking. The dielectric properties of pyrolytically deposited SiO2 can be made to approach those of thermal SiO2 by high temperature densification. The surface electrical properties of the Ge-SiO2 interface are more stable to thermal annealing than is any other Ge-insulator combination. However, aluminum oxide has been shown to be much less permeable to oxygen, hydrogen and water vapor than is SiO2. Since the Ge-insulator interface electrical properties are sensitive to these ambient gases, a satisfactory passivating film structure for Ge consists of an underlayer of SiO2 and an overlayer of Al2O3, silicon nitride or other relatively impermeable film.

Note: The Institute of Electrical and Electronics Engineers, Incorporated is distributing this Article with permission of the International Business Machines Corporation (IBM) who is the exclusive owner. The recipient of this Article may not assign, sublicense, lease, rent or otherwise transfer, reproduce, prepare derivative works, publicly display or perform, or distribute the Article.  

Published in:

IBM Journal of Research and Development  (Volume:14 ,  Issue: 1 )