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Application of RF Discharges to Sputtering

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2 Author(s)
Koenig, H.R. ; IBM Components Division Laboratory, East Fishkill, New York 12533, USA ; Maissel, L.I.

The operation of rf discharges is described and the internal distribution of voltages is considered. The significance of this with respect to sputtering, particularly of insulators, is then discussed. An equivalent circuit for the discharge is presented and the influence of such parameters as pressure and magnetic field on the components of this circuit is described. Finally, energy distributions for positive ions, electrons, and negative ions incident at the substrate during deposition are given.

Note: The Institute of Electrical and Electronics Engineers, Incorporated is distributing this Article with permission of the International Business Machines Corporation (IBM) who is the exclusive owner. The recipient of this Article may not assign, sublicense, lease, rent or otherwise transfer, reproduce, prepare derivative works, publicly display or perform, or distribute the Article.  

Published in:

IBM Journal of Research and Development  (Volume:14 ,  Issue: 2 )

Date of Publication:

March 1970

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