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A Design Study of Ultrasonic Bonding Tips

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1 Author(s)
S. Z. Dushkes ; IBM Systems Development Division laboratory at San Jose, California, USA

The standing wave on ultrasonic bonding tips and the tendency of the lower end to fold back upon itself, termed “lug-down,” have been measured under actual bonding conditions. These phenomena have also been modeled on a computer. Lug-down can be a major contributor to bonding failures in designs having an overly slim tip. One definition of a “bonding failure” is the production of a bond between wire and monolithic circuit pad which lifts, when the wire is pulled at 90° to the pad, under a wire tensile force less than 25% of the ultimate tensile strength of the wire. Improper location of nodes can also contribute to bonding failures. A tapered tip has been shown by mathematical analysis to possess a higher resonant frequency and fewer nodes than a tip of uniform cross section. Using the newly developed taper tip, means were found for minimizing lug-down. With judicious trade-offs, it is now possible to optimize tip geometry for a particular bonding application.

Note: The Institute of Electrical and Electronics Engineers, Incorporated is distributing this Article with permission of the International Business Machines Corporation (IBM) who is the exclusive owner. The recipient of this Article may not assign, sublicense, lease, rent or otherwise transfer, reproduce, prepare derivative works, publicly display or perform, or distribute the Article.  

Published in:

IBM Journal of Research and Development  (Volume:15 ,  Issue: 3 )