Cart (Loading....) | Create Account
Close category search window
 

Solubility and Diffusion of Sulfur in Polymeric Materials

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Berry, B.S. ; IBM Thomas J. Watson Research Center, Yorktown Heights, New York 10598, USA ; Susko, J.R.

Radiotracer techniques were used to study the sorption of sulfur vapor by silicone and epoxy polymers and to obtain information on the diffusion of sulfur in these materials. Sulfur was found to enter silicone polymers solely by a physical solution process which obeys Henry's law. The heat of solution is large (−0.43 eV) and at room temperature the solubility coefficient is at least five orders of magnitude greater than for many fully gaseous solutes, a result which fits an empirical rule relating the solubility coefficient of a given solute to its boiling point. Sorption of sulfur by a flexibilized anhydride-cured diglycidyletherbisphenol-A (DGEBA) epoxy is somewhat more complicated and appears to involve a double process of physical solution and chemical reaction. The rapid diffusion of sulfur in silicone rubber necessitated measurements of the diffusion coefficient D by a vacuum desorption technique. The activation energy Q and pre-exponential constant D0 are found to be 0.74 eV and 4×105cm2/s, respectively. Corresponding values for the epoxy, as determined by a steady state permeation method, are 1.06 eV and 3×105cm2/s. These relatively large activation energies and pre-exponential factors are thought to reflect the large size of the S8 molecule. Near room temperature, the difference in the activation energies causes sulfur diffusion to occur at least four orders of magnitude more slowly in the epoxy, which makes this material much more attractive for encapsulation applications requiring an effective diffusion barrier to elemental sulfur present as a pollutant of the atmosphere.

Note: The Institute of Electrical and Electronics Engineers, Incorporated is distributing this Article with permission of the International Business Machines Corporation (IBM) who is the exclusive owner. The recipient of this Article may not assign, sublicense, lease, rent or otherwise transfer, reproduce, prepare derivative works, publicly display or perform, or distribute the Article.  

Published in:

IBM Journal of Research and Development  (Volume:21 ,  Issue: 2 )

Date of Publication:

March 1977

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.