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Single-Cycle Gas Panel Assembly

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3 Author(s)
Reisman, A. ; IBM Thomas J. Watson Research Center, Yorktown Heights, New York 10598, USA ; Berkenblit, M. ; Chan, S.A.

A single-cycle process has been developed in which the two halves of a gas panel are assembled, sealed, and filled in a continuous, automatically sequenced, controlled-ambient furnace. The entire fabrication operation, including seal, degas, backfill, and tip-off, may be accomplished in a single thermal cycle. During heat-up, the panel parts and furnace chamber are degassed in a programmed cyclic fill (to 20 mm of Hg) and pump-down to (100 µm of Hg). The panels are sealed in a clean-air ambient at a temperature of 495 ± 5°C. Prior to backfilling with a purified Penning gas mixture and tip-off of the panel, the same gas is used in a cyclic fill and evacuate process to remove air and other contaminants. The entire panel fabrication program takes about 8 hours. Details of equipment construction and operation are presented, as well as advantages of the process compared to conventional gas panel fabrication processes.

Note: The Institute of Electrical and Electronics Engineers, Incorporated is distributing this Article with permission of the International Business Machines Corporation (IBM) who is the exclusive owner. The recipient of this Article may not assign, sublicense, lease, rent or otherwise transfer, reproduce, prepare derivative works, publicly display or perform, or distribute the Article.  

Published in:

IBM Journal of Research and Development  (Volume:22 ,  Issue: 6 )