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Cost/Performance Single-Chip Module

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3 Author(s)
Bendz, D.J. ; IBM General Technology Division plant, Endicott, New York 13760, USA ; Gedney, R.W. ; Rasile, J.

The introduction of the high performance T2L device technology for the IBM 4300 Systems and the System/38 required extensions of the 24-mm metallized ceramic module used in prior IBM systems. The extension of the metallized ceramic technology into a physically larger 28-mm module, electrically enhanced with a reference plane and with fine line (0.025-mm) wiring, is described. The reliability of this module was evaluated with particular emphasis on corrosion and metal migration in humid environments and on exposure to atmospheric contaminants.

Note: The Institute of Electrical and Electronics Engineers, Incorporated is distributing this Article with permission of the International Business Machines Corporation (IBM) who is the exclusive owner. The recipient of this Article may not assign, sublicense, lease, rent or otherwise transfer, reproduce, prepare derivative works, publicly display or perform, or distribute the Article.  

Published in:

IBM Journal of Research and Development  (Volume:26 ,  Issue: 3 )