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Quality and Reliability Assurance Systems in IBM Semiconductor Manufacturing

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5 Author(s)
Melan, E.H. ; IBM Data Systems Division, P. O. Box 390, Poughkeepsie, New York 12602, USA ; Curtis, R.T. ; Ho, J.K. ; Koens, J.G.
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Soon after semiconductor manufacturing began it was realized that classical process control techniques were needed for the control of quality, reliability, and yield. The discovery and control of yield, quality, and reliability detractors have been pursued continually by IBM manufacturing engineers ever since, and the resulting evolution of process control techniques has grown into a highly disciplined state. Inferential methods were added later to augment the classic techniques. This paper, in addition to providing a brief overview of semiconductor manufacturing control techniques and placing them into historical perspective, discusses a method of feed-forward control based on statistical distributions which is used in the VLSI FET memory device line. This is followed by a description of a process profile technique which is used in bipolar logic manufacturing. The importance of the system aspects in both techniques is emphasized.

Note: The Institute of Electrical and Electronics Engineers, Incorporated is distributing this Article with permission of the International Business Machines Corporation (IBM) who is the exclusive owner. The recipient of this Article may not assign, sublicense, lease, rent or otherwise transfer, reproduce, prepare derivative works, publicly display or perform, or distribute the Article.  

Published in:

IBM Journal of Research and Development  (Volume:26 ,  Issue: 5 )