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The LT1280 for Through-the-Pins Testing of the Thermal Conduction Module

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2 Author(s)
Pierson, R.L. ; IBM Data Systems Division, P.O. Box 950, Poughkeepsie, New York 12602, USA ; Williams, T.B.

Testing the thermal conduction module (TCM), the high-density field-replaceable unit (FRU) used in the IBM 3081 processor models, and diagnosing the faults encountered to a minimal repairable set of entities posed a new problem for the IBM engineers. The requirement and the economic necessity of thoroughly exercising the entire TCM logic and random access memory (RAM) array structure through the input/output pins of the TCM are discussed. This is followed by a description of the test system alternatives and the LT1280 [logic tester having 1280 input/output (I/O) pins] as the selected TCM manufacturing test system. The TCM logic density and high I/O count required new concepts of test system organization, size, and complexity to achieve a test and diagnostic system with high flexibility and high throughput capability.

Note: The Institute of Electrical and Electronics Engineers, Incorporated is distributing this Article with permission of the International Business Machines Corporation (IBM) who is the exclusive owner. The recipient of this Article may not assign, sublicense, lease, rent or otherwise transfer, reproduce, prepare derivative works, publicly display or perform, or distribute the Article.  

Published in:

IBM Journal of Research and Development  (Volume:27 ,  Issue: 1 )