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Multi-Chip Module Test and Diagnostic Methodology

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2 Author(s)
Curtin, J.J. ; IBM General Technology Division, East Fishkill facility, Hopewell Junction, New York 12533, USA ; Waicukauski, J.A.

The development of a manufacturing test and diagnostic methodology for multi-chip modules as used in the IBM 4300 processor models involves determining the most attractive compromise among a number of conflicting factors: a) high test coverage, b) high diagnostic resolution, c) test generation, d) test equipment, and e) test application and diagnosis. This paper describes a set of solutions which were developed to create a high-volume, low-cost manufacturing test operation for the product in question. This paper examines the role of the testing methodology in productivity and product quality, details the diagnostic approach chosen, and provides an example of the overall manufacturing system performance achieved by analyzing a large module production sample.

Note: The Institute of Electrical and Electronics Engineers, Incorporated is distributing this Article with permission of the International Business Machines Corporation (IBM) who is the exclusive owner. The recipient of this Article may not assign, sublicense, lease, rent or otherwise transfer, reproduce, prepare derivative works, publicly display or perform, or distribute the Article.  

Published in:

IBM Journal of Research and Development  (Volume:27 ,  Issue: 1 )