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In addition to semiconductor chip fabrication, the manufacturing of computer parts involves many disciplines which must be carefully controlled to produce the very complex components that make up a computing system. The editors of the IBM Journal of Research and Development were intrigued by the challenge of providing some insight into the technology that makes the present computer generation possible. We gave our readers a view of the advanced packaging concepts used in the IBM 3081 processor in the January 1982 issue; in the May 1982 issue we further explored computer circuitry packaging trends. In September 1982 we investigated IBM's semiconductor manufacturing technology. In this issue we delve into the disciplines and machinery which are used to assemble and test the component parts of a large-scale computer.

Note: The Institute of Electrical and Electronics Engineers, Incorporated is distributing this Article with permission of the International Business Machines Corporation (IBM) who is the exclusive owner. The recipient of this Article may not assign, sublicense, lease, rent or otherwise transfer, reproduce, prepare derivative works, publicly display or perform, or distribute the Article.  

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IBM Journal of Research and Development  (Volume:27 ,  Issue: 1 )