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Initiation of electroless Cu plating on nonmetallic surfaces

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3 Author(s)
J. Horkans ; IBM Research Division, P. O. Box 218, Yorktown Heights, New York 10598, USA ; C. Sambucetti ; V. Markovich

Electroless plating of a metal on a dielectric substrate requires the prior deposition of a catalyst such as a Pd-Sn colloid consisting of a metallic Pd core surrounded by a stabilizing layer of Sn ions. The activation step (deposition of the colloid) is usually followed by an acceleration step (removal of excess ionic tin). Adhesion of the deposit to the substrate is improved by mechanical and chemical pretreatment steps. An electrochemical method has been developed for assessing the catalytic activity of Pd-Sn colloids. Hydrogen sorption in the Pd in the colloid can be correlated with catalytic activity, since Pd accessible for the H-sorption reaction is also accessible as the catalyst for the electroless deposition reaction. These conclusions have been confirmed by surface analytical techniques and by functional tests. The efficacy of various accelerating solutions has also been assessed.

Note: The Institute of Electrical and Electronics Engineers, Incorporated is distributing this Article with permission of the International Business Machines Corporation (IBM) who is the exclusive owner. The recipient of this Article may not assign, sublicense, lease, rent or otherwise transfer, reproduce, prepare derivative works, publicly display or perform, or distribute the Article.  

Published in:

IBM Journal of Research and Development  (Volume:28 ,  Issue: 6 )