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Novel method for analysis of printed circuit images

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1 Author(s)
Jon R. Mandeville ; IBM Research Division, P.O. Box 218, Yorktown Heights, New York 10598, USA

To keep pace with the trend towards increased circuit integration, printed circuit patterns are becoming denser and more complex. A variety of automated visual inspection methods to detect circuit defects during manufacturing have been proposed. This paper describes a method which is a synthesis of the reference-comparison and the generic-property approaches that exploits their respective strengths and overcomes their respective weaknesses. It is based on the observation that the local geometric and global topological correctness of a printed circuit can be inferred from the correctness of simplified, skeletal versions of the circuit in a test image. These operations can be realized using simple processing elements which are well suited for implementation in hardware.

Note: The Institute of Electrical and Electronics Engineers, Incorporated is distributing this Article with permission of the International Business Machines Corporation (IBM) who is the exclusive owner. The recipient of this Article may not assign, sublicense, lease, rent or otherwise transfer, reproduce, prepare derivative works, publicly display or perform, or distribute the Article.  

Published in:

IBM Journal of Research and Development  (Volume:29 ,  Issue: 1 )