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Cathodic delamination of methyl methacrylate-based dry film polymers on copper

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4 Author(s)
Atkinson, J.M. ; IBM Systems Technology Division, P. O. Box 6, Endicott, New York 13760, USA ; Granata, R.D. ; Leidheiser, H. ; McBride, D.G.

Studies of the bond degradation between a laminated organic coating and a copper substrate have been carried out using electrochemical techniques. The failure of the bond is attributed to a cathodic reaction which occurs under the coating. The rates of delamination are shown to be affected by delay time after exposure, temperature, applied potential, composition of the electrolyte, and surface abrasion prior to application of the coating.

Note: The Institute of Electrical and Electronics Engineers, Incorporated is distributing this Article with permission of the International Business Machines Corporation (IBM) who is the exclusive owner. The recipient of this Article may not assign, sublicense, lease, rent or otherwise transfer, reproduce, prepare derivative works, publicly display or perform, or distribute the Article.  

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IBM Journal of Research and Development  (Volume:29 ,  Issue: 1 )