By Topic

Advanced bipolar transistor modeling: Process and device simulation tools for today's technology

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Knepper, R.W. ; IBM General Technology Division, East Fishkill facility, Route 52, Hopewell Junction, New York 12533, USA ; Gaur, S.P. ; Chang, F.-Y. ; Srinivasan, G.R.

A series of programs have been developed and linked together for doing advanced transistor modeling. The strategy begins with a process modeling program, SAFEPRO, for predicting two-dimensional impurity profiles. These are input to a two-dimensional device physics modeling program, 2DP, for generating device electrical characteristics. A three-dimensional distributed device model is then assembled by a model generator program (MGP) which, in turn, is used to derive a lumped equivalent-circuit model for numerical circuit analysis. The tools make it possible to do process sensitivity studies, perform process and device optimization, and provide early feedback on technology performance. The approach has recently been used to examine and compare various technologies at IBM.

Note: The Institute of Electrical and Electronics Engineers, Incorporated is distributing this Article with permission of the International Business Machines Corporation (IBM) who is the exclusive owner. The recipient of this Article may not assign, sublicense, lease, rent or otherwise transfer, reproduce, prepare derivative works, publicly display or perform, or distribute the Article.  

Published in:

IBM Journal of Research and Development  (Volume:29 ,  Issue: 3 )