By Topic

Thermal behavior of resistive ribbon for single-stylus excitation

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Laff, Robert A. ; IBM Research Division, P.O. Box 218, Yorktown Heights, New York 10598, USA ; Makowka, Claus D.

This paper provides a quantitative description of the heating and cooling behavior of the resistive ribbon used in resistive ribbon thermal transfer printing. Since the focus is upon the ribbon, this description has been facilitated by substituting a single, tapered tungsten stylus as a model for a single printhead element. The experiment used an infrared spot pyrometer to measure ribbon surface temperatures downstream from the stylus while a laminate of ribbon and paper was continuously moved beneath the stylus and subjected to current pulses. Measured cooling rates under steady-state excitation at different ribbon velocities showed a behavior consistent with two simple analytic models which describe heat loss into the stylus during heating and two-dimensional diffusion into a half-plane during cooling. A detailed, time-dependent computer simulation using finite-element methods was used to provide a more detailed description of the process by taking into account the local geometry of the heat input distribution and the layered nature of the ribbon-paper laminate. The resulting three-dimensional temperature distributions are given for the steady-state case.

Note: The Institute of Electrical and Electronics Engineers, Incorporated is distributing this Article with permission of the International Business Machines Corporation (IBM) who is the exclusive owner. The recipient of this Article may not assign, sublicense, lease, rent or otherwise transfer, reproduce, prepare derivative works, publicly display or perform, or distribute the Article.  

Published in:

IBM Journal of Research and Development  (Volume:29 ,  Issue: 5 )