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Resistive ribbon thermal transfer printing: A historical review and introduction to a new printing technology

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2 Author(s)
Pennington, Keith S. ; IBM Reseurch Division, P.O.B ox 218, Yorktown Heights, New York 10598, USA ; Crooks, W.

This paper describes a new high-quality thermal transfer printing process in which a printhead consisting of a linear array of small-diameter electrodes produces highly localized Joule heating of a resistive thermal transfer printing ribbon. The heat generated in the resistive ribbon results in the melting of a thermoplastic ink which is then transferred to a printable medium, such as paper, by contact. The origins of the technology in IBM are discussed, together with a description of the resistive ribbon materials and structure, the printhead, and some experimental printer performance values.

Note: The Institute of Electrical and Electronics Engineers, Incorporated is distributing this Article with permission of the International Business Machines Corporation (IBM) who is the exclusive owner. The recipient of this Article may not assign, sublicense, lease, rent or otherwise transfer, reproduce, prepare derivative works, publicly display or perform, or distribute the Article.  

Published in:

IBM Journal of Research and Development  (Volume:29 ,  Issue: 5 )

Date of Publication:

Sept. 1985

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