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Signal degradation through module pins in VLSI packaging

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2 Author(s)
Huang, Ching-Chao ; IBM General Technology Division, East Fishkill facility, Route 52, Hopewell Junction, New York 12533, USA ; Wu, L.L.

This paper investigates chip-to-chip communication through the modules and board in VLSI packaging. Transmission line models and frequency-dependent transmission line parameters are used in finding the frequency response. The time-domain solution is then obtained through the inverse Fast Fourier Transform. The results show that uncoated module pins, even of relatively short length, can cause severe signal degradation because of their magnetic property. The signal behavior is improved dramatically, however, when the module pins are coated with nonmagnetic conductive material.

Note: The Institute of Electrical and Electronics Engineers, Incorporated is distributing this Article with permission of the International Business Machines Corporation (IBM) who is the exclusive owner. The recipient of this Article may not assign, sublicense, lease, rent or otherwise transfer, reproduce, prepare derivative works, publicly display or perform, or distribute the Article.  

Published in:

IBM Journal of Research and Development  (Volume:31 ,  Issue: 4 )