By Topic

Geometric tolerancing: II. Conditional tolerances

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Srinivasan, V. ; IBM Research Division, T. J. Watson Research Center, P.O. Box 218, Yorktown Heights, New York 10598, USA ; Jayaraman, Rangarajan

In a companion paper, we examined the representation of geometric tolerances in solid models from the perspective of certain functional requirements. We showed that assembly and material bulk requirements can be specified as virtual boundary requirements (VBRs). Here, we study the related issue of deriving equivalent alternative specifications. Specifically, we first explore the reasons for converting VBRs to another form of tolerances designated as conditional tolerances (CTs). We then develop a theoretical basis for converting VBRs to CTs and derive CTs for some common and practical VBRs. We thereby demonstrate the difficulties in finding a general-purpose algorithm for such conversions and also show that some of the CT formulas used in current practice are incorrect.

Note: The Institute of Electrical and Electronics Engineers, Incorporated is distributing this Article with permission of the International Business Machines Corporation (IBM) who is the exclusive owner. The recipient of this Article may not assign, sublicense, lease, rent or otherwise transfer, reproduce, prepare derivative works, publicly display or perform, or distribute the Article.  

Published in:

IBM Journal of Research and Development  (Volume:33 ,  Issue: 2 )