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Electron-beam technology for open/short testing of multi-chip substrates

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4 Author(s)
Golladay, S.D. ; IBM General Technology Division, East Fishkill facility, Route 52, Hopewell Junction, New York 1253, USA ; Wagner, N.A. ; Rudert, J.R. ; Schmidt, R.N.

We discuss the need for noncontact electrical testing of high-performance multi-chip substrates and describe an electron-beam tester developed for this application. We describe the operational principles of the tester and compare and contrast its performance with that of mechanical probe testers. Finally, we discuss the motivations and technical issues involved in extending the electron-beam test method to future high-performance packages.

Note: The Institute of Electrical and Electronics Engineers, Incorporated is distributing this Article with permission of the International Business Machines Corporation (IBM) who is the exclusive owner. The recipient of this Article may not assign, sublicense, lease, rent or otherwise transfer, reproduce, prepare derivative works, publicly display or perform, or distribute the Article.  

Published in:

IBM Journal of Research and Development  (Volume:34 ,  Issue: 2.3 )