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Finite element analysis of planar stress anisotropy and thermal behavior in thin films

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1 Author(s)
Young, K.F. ; Storage Systems Products Division, 5600 Cottle Road, San Jose, California 95193, USA

To show the capability and diversity of finite element analysis, we calculate three-dimensional planar anisotropic stress distributions for various thin-film geometries and materials in response to thermal and electrical stimuli, for specific boundary conditions. The simulated residual film stresses are verified with acoustic microscopy measurements, substrate flexure measurements, and the use of thermal environment techniques. Simple shapes are analyzed as building blocks for more complex structures. Effects of nonlinear electrical resistance are also analyzed.

Note: The Institute of Electrical and Electronics Engineers, Incorporated is distributing this Article with permission of the International Business Machines Corporation (IBM) who is the exclusive owner. The recipient of this Article may not assign, sublicense, lease, rent or otherwise transfer, reproduce, prepare derivative works, publicly display or perform, or distribute the Article.  

Published in:

IBM Journal of Research and Development  (Volume:34 ,  Issue: 5 )