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An electromagnetic approach for modeling high-performance computer packages

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1 Author(s)
B. J. Rubin ; IBM Research Division, Thomas J. Watson Research Center, P.O. Box 218. Yorktown Heights, New York 10598, USA

Described here is an electromagnetic approach for the analysis of high-performance computer packages such as the thermal conduction module (TCM) used in the IBM 3080 and 3090 processor units. Modeling of signal paths and limitations of previous methods are discussed. Numerical results are presented for propagation characteristics associated with signal lines and vias, and for coupled noise between signal lines. The results are compared with those obtained by means of test vehicles, scale models, and capacitance calculations.

Note: The Institute of Electrical and Electronics Engineers, Incorporated is distributing this Article with permission of the International Business Machines Corporation (IBM) who is the exclusive owner. The recipient of this Article may not assign, sublicense, lease, rent or otherwise transfer, reproduce, prepare derivative works, publicly display or perform, or distribute the Article.  

Published in:

IBM Journal of Research and Development  (Volume:34 ,  Issue: 4 )