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Described here is an electromagnetic approach for the analysis of high-performance computer packages such as the thermal conduction module (TCM) used in the IBM 3080 and 3090 processor units. Modeling of signal paths and limitations of previous methods are discussed. Numerical results are presented for propagation characteristics associated with signal lines and vias, and for coupled noise between signal lines. The results are compared with those obtained by means of test vehicles, scale models, and capacitance calculations.
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