By Topic

TDI charge-coupled devices: Design and applications

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Wong, H.-S. ; IBM Research Division, Thomas J. Heights, New York 10598, USA ; Yao, Y.L. ; Schlig, E.S.

The design and applications of charge-coupled devices (CCDs) operated in the time-delay-and-integration (TDI) mode are reviewed. Design issues regarding the use of the TDI-CCD imager for visible imaging applications are discussed. Aspects pertaining to its parallel array, serial-to-parallel interface, serial register, modulation transfer function (MTF), discrete charge motion, motion synchronization, clocking, number of integrating stages, noise, dynamic range, sensitivity, output uniformity, device yield, pixel size, and spectral response are highlighted in the context of their effect on system performance. Its imaging characteristics are compared to those of the photodiode linear array imager, and design studies and experimental results for a family of TDI-CCD imagers for scanning documents and museum art objects are described. .sk 4mm

Note: The Institute of Electrical and Electronics Engineers, Incorporated is distributing this Article with permission of the International Business Machines Corporation (IBM) who is the exclusive owner. The recipient of this Article may not assign, sublicense, lease, rent or otherwise transfer, reproduce, prepare derivative works, publicly display or perform, or distribute the Article.  

Published in:

IBM Journal of Research and Development  (Volume:36 ,  Issue: 1 )