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Low-inductance decoupling capacitor for the thermal conduction modules of the IBM Enterprise System/9000 processors

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4 Author(s)
Humenik, J.N. ; IBM Technology Products, East Fishkill facility, Hopewell Junction, New York 12533, USA ; Oberschmidt, J.M. ; Wu, L.L. ; Paull, S.G.

Multilayer ceramic decoupling capacitors fabricated using a barium titanate-based dielectric are used with the glass-ceramic/copper/polyimide substrates of the thermal conduction modules (TCMs) of the IBM Enterprise System/9000™ processors to suppress the voltage noise generated by the logic circuits of the semiconductor chips used in the processors. Use is made of thick-film multilayer ceramic fabrication processes and thin-film termination processes to achieve substrate-mounted capabilities which, when combined with the low-inductance design of the capacitors, minimize the inductance of the decoupling paths to their adjacent chips. When mounted on the glass-ceramic/copper/polyimide substrate of a water-cooled TCM, the capacitors suppress approximately 50% of the voltage noise, thereby enhancing the performance of the TCMs.

Note: The Institute of Electrical and Electronics Engineers, Incorporated is distributing this Article with permission of the International Business Machines Corporation (IBM) who is the exclusive owner. The recipient of this Article may not assign, sublicense, lease, rent or otherwise transfer, reproduce, prepare derivative works, publicly display or perform, or distribute the Article.  

Published in:

IBM Journal of Research and Development  (Volume:36 ,  Issue: 5 )

Date of Publication:

Sept. 1992

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