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Electrical connections to the thermal conduction modules of the IBM Enterprise System/9000 water-cooled processors

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3 Author(s)
P. J. Brofman ; IBM Technology Products, East Fishkill facility, Route 52, Hopewell Junction, New York 12533, USA ; S. K. Ray ; K. F. Beckham

In a complex multichip carrier such as the thermal conduction module (TCM) of IBM high-performance mainframe processors, the interfaces between chips and their substrate as well as between the substrate and its printed circuit board must support a large number of electrical connections. Since chip, substrate, and board typically comprise very different materials, the electrical connections between them must be able to accommodate considerable thermally induced mechanical stress during assembly and use. This paper describes the pin attachment, chip attachment, wire bonding, and laser deletion processes used for forming the electrical connections to the glass-ceramic/copper/polyimide /copper substrate of the thermal conduction modules of the IBM Enterprise System/9000™ water-cooled processors.

Note: The Institute of Electrical and Electronics Engineers, Incorporated is distributing this Article with permission of the International Business Machines Corporation (IBM) who is the exclusive owner. The recipient of this Article may not assign, sublicense, lease, rent or otherwise transfer, reproduce, prepare derivative works, publicly display or perform, or distribute the Article.  

Published in:

IBM Journal of Research and Development  (Volume:36 ,  Issue: 5 )