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Equipment-related advances in the fabrication of glass-ceramic/copper/polyimide substrates

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4 Author(s)
Kranik, J.R. ; IBM Technology Products, East Fishkill facility, Hopewell Junction, New York 12533, USA ; Fulton, J.J. ; Su, L.-S. ; Zimmerman, S.M.

This paper pertains to the equipment used to produce the multilayer glass-ceramic/copper/polyimide substrates of the thermal conduction modules (TCMs) used in the IBM Enterprise System/9000™ water-cooled processors. Discussed are a flexible equipment concept applied to the punching, inspection, and testing of the glass-ceramic/copper portion of the substrates, and laser-based equipment for ablation and repair of their polyimide/copper thin-film portion.

Note: The Institute of Electrical and Electronics Engineers, Incorporated is distributing this Article with permission of the International Business Machines Corporation (IBM) who is the exclusive owner. The recipient of this Article may not assign, sublicense, lease, rent or otherwise transfer, reproduce, prepare derivative works, publicly display or perform, or distribute the Article.  

Published in:

IBM Journal of Research and Development  (Volume:36 ,  Issue: 5 )