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IBM recently introduced a family of large-scale processors known as Enterprise System/9000 (ES/9000). This issue of the IBM Journal of Research and Development describes many of the technical advances made in semiconductor and packaging technologies used in these processors. The preceding issue of the Journal focused on System/390 architecture and on ES/9000 processor and power/thermal system designs, while the ES/9000 air-cooled processors were described in an earlier issue (IBM Journal of Research and Development 35, No. 3, 1991).
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