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Resist materials and processes for X-ray lithography

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1 Author(s)
Seeger, David ; IBM Research Division, Thomas J. Watson Research Center, P.O. Box 218, Yorktown Heights, New York 10598, USA

A key component that is sometimes overlooked in X-ray lithography is the resist material. The lithographic properties of these materials are extremely important if one is to take advantage of the superior lithographic performance often observed in X-ray lithography. The properties of such materials may even be more important than in conventional optical lithography, since the feature sizes delineated by this lithographic technique are much smaller. A description of X-ray resists is presented which discusses both the chemistry and the lithographic properties of these materials. The characterization and stability of these processes are highlighted.

Note: The Institute of Electrical and Electronics Engineers, Incorporated is distributing this Article with permission of the International Business Machines Corporation (IBM) who is the exclusive owner. The recipient of this Article may not assign, sublicense, lease, rent or otherwise transfer, reproduce, prepare derivative works, publicly display or perform, or distribute the Article.  

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IBM Journal of Research and Development  (Volume:37 ,  Issue: 3 )