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Fracture mechanics for thin-film adhesion

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1 Author(s)
Thouless, M.D. ; IBM Research Division, Thomas J. Watson Research Center, P. O. Box 218, Yorktown Heights, New York 10598, USA

The essential elements of the mechanics of delamination are reviewed and their implications for design are discussed. Two important concepts for the prediction of the reliability of thin-film systems are emphasized: 1) limiting solutions for the crack-driving force that are independent of flaw size, and 2) “mixed-mode fracture.” Consideration of the first concept highlights the possibility of flaw-tolerant design in which the statistical effects associated with flaw distributions can be eliminated. The significance of mode-mixedness includes its effect on crack trajectories and on the interface toughness, two key variables in determining failure mechanisms. Theoretical predictions are given for some cases of delamination of thin films under compressive stresses, and the results are compared with experimental observations to illustrate appropriate design criteria for the model systems studied.

Note: The Institute of Electrical and Electronics Engineers, Incorporated is distributing this Article with permission of the International Business Machines Corporation (IBM) who is the exclusive owner. The recipient of this Article may not assign, sublicense, lease, rent or otherwise transfer, reproduce, prepare derivative works, publicly display or perform, or distribute the Article.  

Published in:

IBM Journal of Research and Development  (Volume:38 ,  Issue: 4 )