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1 Author(s)
Mittal, K. L. ; 92 Saddle Ridge Drive Hopewell Junction, NY 12533, USA

Adhesion between similar or dissimilar materials is of vital importance to IBM in the manufacture of products such as multilayer electronic devices and integrated circuits, printed circuit boards, and magnetic head and disk assemblies. For products to function reliably and reproducibly, ways must be devised to understand and tailor the requisite adhesion strengths between materials.

Note: The Institute of Electrical and Electronics Engineers, Incorporated is distributing this Article with permission of the International Business Machines Corporation (IBM) who is the exclusive owner. The recipient of this Article may not assign, sublicense, lease, rent or otherwise transfer, reproduce, prepare derivative works, publicly display or perform, or distribute the Article.  

Published in:

IBM Journal of Research and Development  (Volume:38 ,  Issue: 4 )

Date of Publication:

July 1994

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