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Manufacturing with DUV lithography

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3 Author(s)
Holmes, S.J. ; IBM Microelectronics Division, Burlington facility, Essex Junction, Vermont 05452, USA ; Mitchell, P.H. ; Hakey, M.C.

Deep-UV (DUV) lithography has been developed to scale minimum feature sizes of devices on semiconductor chips to sub-half-micron dimensions. This paper reviews early manufacturing experiences at the IBM Microelectronics Division with deep ultraviolet (DUV) lithography at a 248-nm wavelength. Critical steps in the processing of 1Mb DRAM, 16Mb DRAM, and logic gate conductors in devices are discussed. The evolution of DUV lithography tools is also briefly reviewed.

Note: The Institute of Electrical and Electronics Engineers, Incorporated is distributing this Article with permission of the International Business Machines Corporation (IBM) who is the exclusive owner. The recipient of this Article may not assign, sublicense, lease, rent or otherwise transfer, reproduce, prepare derivative works, publicly display or perform, or distribute the Article.  

Published in:

IBM Journal of Research and Development  (Volume:41 ,  Issue: 1.2 )