Skip to Main Content
Electrolytic plating is used to produce the interconnect wiring on the current generation of high-performance multichip modules used in IBM S/390® and AS/400® servers. This paper reviews the material and manufacturing requirements for successful implementation of a multilayer high-density wiring pattern involving electroplated copper metal and polyimide ielectric. Various strategies for the construction of thin-film structures (planarized and nonplanarized) are outlined, and the advantages of electrolytic plating over dry deposition techniques are described.
Note: The Institute of Electrical and Electronics Engineers, Incorporated is distributing this Article with permission of the International Business Machines Corporation (IBM) who is the exclusive owner. The recipient of this Article may not assign, sublicense, lease, rent or otherwise transfer, reproduce, prepare derivative works, publicly display or perform, or distribute the Article.