By Topic

Future directions in electroplated materials for thin-film recording heads

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Andricacos, P.C. ; IBM Research Division, Thomas J. Watson Research Center, Yorktown Heights, New York 10598, USA ; Robertson, N.

The need for recording heads to write on high-coercivity media at high frequencies has created new requirements for the write-head material that cannot be met by Ni80Fe20, the nickel-iron alloy traditionally used in the fabrication of the device. Electroplating through a mask, the method of choice for depositing nickel-iron alloys, makes it possible to pattern and orient the magnetic film more readily than by other methods. We review here research performed mostly in the United States and in Japan to develop electroplated magnetic materials that can meet the new challenges of data storage technology. High-iron nickel-iron alloys (Ni45Fe55) have higher magnetic moment and resistivity than their low-iron counterparts and are increasingly being used in head fabrication. The addition of impurities in a controlled manner has been shown to produce drastic improvement in the properties of electroplated materials. And technology has been developed to fabricate laminated materials by electroplating from a single plating solution. Despite these advances in the electrodeposition of magnetic alloys, more research is required for electroplating processes to meet all of the challenges of data storage technology.

Note: The Institute of Electrical and Electronics Engineers, Incorporated is distributing this Article with permission of the International Business Machines Corporation (IBM) who is the exclusive owner. The recipient of this Article may not assign, sublicense, lease, rent or otherwise transfer, reproduce, prepare derivative works, publicly display or perform, or distribute the Article.  

Published in:

IBM Journal of Research and Development  (Volume:42 ,  Issue: 5 )