By Topic

Thin-film multichip module packages for high-end IBM servers

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)
Perfecto, E.D. ; IBM Microelectronics Division, East Fishkill facility, Route 52, Hopewell Junction, New York 12533, USA ; Giri, A.P. ; Shields, R.R. ; Longworth, H.P.
more authors

A new generation of multilevel thin-film packages has been developed for IBM high-end S/390® and AS/400® systems. Thin-film structures in these packages are nonplanar and can be fabricated by either pattern electroplating or subtractive etching. Selection criteria for choice of fabrication methods are discussed in terms of electrical performance requirements, ground rules, manufacturability, and cost issues. Two problems encountered in the development phase of the nonplanar thin-film structures were 1) accelerated etching of plated Cu features during Cu seed etching, and 2) corrosion of the bottom-surface metallurgy during etching of Cr at the top surface. Effective solutions were developed on the basis of underlying electrochemical phenomena. Finally, reliability stress procedures used to qualify these packages and results of these procedures are presented.

Note: The Institute of Electrical and Electronics Engineers, Incorporated is distributing this Article with permission of the International Business Machines Corporation (IBM) who is the exclusive owner. The recipient of this Article may not assign, sublicense, lease, rent or otherwise transfer, reproduce, prepare derivative works, publicly display or perform, or distribute the Article.  

Published in:

IBM Journal of Research and Development  (Volume:42 ,  Issue: 5 )