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MCM technology and design for the S/390 G5 system

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13 Author(s)
Katopis, G.A. ; IBM System/390 Division, 522 South Road, Poughkeepsie, New York 12601, USA ; Becker, W.D. ; Mazzawy, T.R. ; Smith, H.H.
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The multichip module (MCM) that contains the central electronic complex (CEC) of the S/390® G5 system is described in this paper. The glass-ceramic module, topped with six layers of polyimide full-field thin-film wiring for chip-to-chip interconnection, represents IBM's most advanced packaging technology. This MCM provides a large wiring capacity, with 595 meters of routed interconnection; it supports the highest synchronous interconnection performance in the industry at 300 MHz; and it allows for cooling flexibility at the system level—either a heat sink for air-cooled systems or a cooling “hat” for systems using refrigeration cooling. The physical and electrical characteristics of this packaging technology, necessary to support the aggressive system performance goals (1040 MIPS) of the IBM G5 Enterprise Servers, are presented here. In addition, the approach used to produce a robust electrical and physical design is described.

Note: The Institute of Electrical and Electronics Engineers, Incorporated is distributing this Article with permission of the International Business Machines Corporation (IBM) who is the exclusive owner. The recipient of this Article may not assign, sublicense, lease, rent or otherwise transfer, reproduce, prepare derivative works, publicly display or perform, or distribute the Article.  

Published in:

IBM Journal of Research and Development  (Volume:43 ,  Issue: 5.6 )

Date of Publication:

Sept. 1999

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