By Topic

X-ray spectro-microscopy of complex materials and surfaces

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $33
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
J. Stohr ; Stanford Synchrotron Radiation Laboratory, P.O. Box 20450, MS 69, California 94309, USA ; S. Anders

The detailed understanding of complex materials used in information technology requires the use of state-of-the-art experimental techniques that provide information on the electronic and magnetic properties of the materials. The increasing miniaturization of components furthermore demands the use of techniques with spatial resolution down to the nanometer range. A means to satisfy both requirements is to combine the capabilities of conventional X-ray absorption spectroscopy with those of electron microscopy in a new technique designated as X-ray photoemission electron microscopy. This paper reviews the principles of this new spectro-microscopy approach and presents selected applications to the study of materials of interest in information technology.

Note: The Institute of Electrical and Electronics Engineers, Incorporated is distributing this Article with permission of the International Business Machines Corporation (IBM) who is the exclusive owner. The recipient of this Article may not assign, sublicense, lease, rent or otherwise transfer, reproduce, prepare derivative works, publicly display or perform, or distribute the Article.  

Published in:

IBM Journal of Research and Development  (Volume:44 ,  Issue: 4 )