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TCAD development for lithography resolution enhancement

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6 Author(s)
L. W. Liebmann ; IBM Microelectronics Division, East Fishkill facility, Route 52, Hopewell Junction, New York 12533, USA ; S. M. Mansfield ; A. K. Wong ; M. A. Lavin
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Advances in lithography have contributed significantly to the advancement of the integrated circuit technology. While non-optical next-generation lithography (NGL) solutions are being developed, optical lithography continues to be the workhorse for high-throughput very-large-scale integrated (VLSI) lithography. Extending optical lithography to the resolution levels necessary to support today's aggressive product road maps increasingly requires the use of resolution-enhancement techniques. This paper presents an overview of several resolution-enhancement techniques being developed and implemented in IBM for its leading-edge CMOS logic and memory products.

Note: The Institute of Electrical and Electronics Engineers, Incorporated is distributing this Article with permission of the International Business Machines Corporation (IBM) who is the exclusive owner. The recipient of this Article may not assign, sublicense, lease, rent or otherwise transfer, reproduce, prepare derivative works, publicly display or perform, or distribute the Article.  

Published in:

IBM Journal of Research and Development  (Volume:45 ,  Issue: 5 )