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This study was undertaken to improve understanding of the mechanics of residual stresses in electronic assemblies when subjected to thermal cycles. Strain-gauge measurements of stress and finite element analysis were performed to determine the residual strain level in an epoxy adhesive. Discrepancies in the stress value between experimental methods and those predicted from the finite element model highlight the necessity of incorporating temperature-dependent material properties into the model. Furthermore, the effects of curing conditions on the epoxy layer were also quantified in terms of strain levels.
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