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Strain measurement and numerical analysis of an epoxy adhesive subjected to thermal loads

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2 Author(s)
Kuczynski, J. ; IBM Server Group, 3605 Highway 52 N, Rochester, Minnesota 55901, USA ; Sinha, A.K.

This study was undertaken to improve understanding of the mechanics of residual stresses in electronic assemblies when subjected to thermal cycles. Strain-gauge measurements of stress and finite element analysis were performed to determine the residual strain level in an epoxy adhesive. Discrepancies in the stress value between experimental methods and those predicted from the finite element model highlight the necessity of incorporating temperature-dependent material properties into the model. Furthermore, the effects of curing conditions on the epoxy layer were also quantified in terms of strain levels.

Note: The Institute of Electrical and Electronics Engineers, Incorporated is distributing this Article with permission of the International Business Machines Corporation (IBM) who is the exclusive owner. The recipient of this Article may not assign, sublicense, lease, rent or otherwise transfer, reproduce, prepare derivative works, publicly display or perform, or distribute the Article.  

Published in:

IBM Journal of Research and Development  (Volume:45 ,  Issue: 6 )