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IBM eServer z900 I/O subsystem

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9 Author(s)
Stigliani, D.J. ; IBM Server Group, 2455 South Road, Poughkeepsie, New York 12601, USA ; Bubb, T.E. ; Casper, D.F. ; Chin, J.H.
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The IBM eServer z900 is the first in a generation of future eServers that continues its leadership via a new I/O subsystem with enhancements in capability, performance, configuration management, and qualities of service. Significant features of the I/O subsystem are included to support the 64-bit z/Architecture™ and configuration-management enhancements [e.g., assignable channel path identifiers (CHPIDs) and dynamic channel path management (DCM)]. A 1GB/s self-timed interface (STI), I/O infrastructure, and I/O card cage are described which support the high-bandwidth I/O (e.g., FICON™, Ethernet). These improvements yield enhanced configuration flexibility and connectivity, as well as reliability, availability, and serviceability (RAS), while providing for future bandwidth growth. The various types of I/O ports supported by the IBM eServer z900 platform are also discussed. A common I/O platform is discussed which has been used to provide a uniform, high-bandwidth attachment of industry-standard peripheral computer interface (PCI) cards, while maintaining the leadership functionality and RAS of the eServer zSeries™. A high-density (16-port) ESCON® I/O card has been designed by exploiting IBM advanced CMOS and state-of-the-art fiber optic technologies. Finally, a high-performance, high-density intersystem channel (ISC-3) coupling link I/O card has been developed for the IBM eServer z900 by leveraging advanced technology and packaging techniques.

Note: The Institute of Electrical and Electronics Engineers, Incorporated is distributing this Article with permission of the International Business Machines Corporation (IBM) who is the exclusive owner. The recipient of this Article may not assign, sublicense, lease, rent or otherwise transfer, reproduce, prepare derivative works, publicly display or perform, or distribute the Article.  

Published in:

IBM Journal of Research and Development  (Volume:46 ,  Issue: 4.5 )