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Issues and strategies for the physical design of system-on-a-chip ASICs

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5 Author(s)
Bednar, T.R. ; IBM Microelectronics Division, Burlington facility, Essex Junction, Vermont 05452, USA ; Buffet, P.H. ; Darden, R.J. ; Gould, S.W.
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The density and performance of advanced silicon technologies have made system-on-a-chip ASICs possible. SoCs bring together a diverse set of functions and technology features on a single die of enormous complexity. The physical design of these complex ASICs requires a rich set of functional elements that integrate efficiently with a set of design flows and tools productive enough to meet product requirements successfully, without consuming more time or design resources than a simpler design. The architecture described, including functional libraries and physical design conventions, enables the creation of multiple SoC ASIC designs from a common infrastructure that addresses silicon integration, electrical robustness, and packaging challenges. An implementation strategy follows from this design infrastructure that includes hierarchical design concepts, placement, routing, and verification processes.

Note: The Institute of Electrical and Electronics Engineers, Incorporated is distributing this Article with permission of the International Business Machines Corporation (IBM) who is the exclusive owner. The recipient of this Article may not assign, sublicense, lease, rent or otherwise transfer, reproduce, prepare derivative works, publicly display or perform, or distribute the Article.  

Published in:

IBM Journal of Research and Development  (Volume:46 ,  Issue: 6 )

Date of Publication:

Nov. 2002

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