Cart (Loading....) | Create Account
Close category search window
 

Exploitation of optical interconnects in future server architectures

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Benner, A.F. ; IBM Systems and Technology Group, 2455 South Road, Poughkeepsie, New York 12601, USA ; Ignatowski, M. ; Kash, J.A. ; Kuchta, D.M.
more authors

Optical fiber links have become ubiquitous for links at the metropolitan and wide area distance scales, and have become common alternatives to electrical links in local area networks and cluster networks. As optical technology improves and link frequencies continue to increase, optical links will be increasingly considered for shorter, higher-bandwidth links such as I/O, memory, and system bus links. For these links closer to processors, issues such as packaging, power dissipation, and components cost assume increasing importance along with link bandwidth and link distance. Also, as optical links move steadily closer to the processors, we may see significant differences in how servers, particularly high-end servers, are designed and packaged to exploit the unique characteristics of optical interconnects. This paper reviews the various levels of a server interconnect hierarchy and the current status of optical interconnect technology for these different levels. The potential impacts of optical interconnect technology on future server designs are also reviewed.

Note: The Institute of Electrical and Electronics Engineers, Incorporated is distributing this Article with permission of the International Business Machines Corporation (IBM) who is the exclusive owner. The recipient of this Article may not assign, sublicense, lease, rent or otherwise transfer, reproduce, prepare derivative works, publicly display or perform, or distribute the Article.  

Published in:

IBM Journal of Research and Development  (Volume:49 ,  Issue: 4.5 )

Date of Publication:

July 2005

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.