By Topic

Packaging design challenges of the IBM System z10 Enterprise Class server

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $33
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

11 Author(s)
T. -M. Winkel ; IBM Systems and Technology Group, IBM Entwicklung GmbH, Schoenaicherstrasse 220, 71032 Boeblingen, Germany ; H. Harrer ; D. Kaller ; J. Supper
more authors

This paper describes the system packaging and technologies of the IBM System z10™ high-end Enterprise Class server. This machine exceeds the multiprocessor performance of the previous system by 50%. A new generation of the IBM Elastic Interface was developed in order to maintain the increased interconnect signal speed of up to 2.93 Gb/s. Power control and power delivery to the multicore processors were a special challenge for the server packaging because of the high currents and the high number of voltage domains.

Note: The Institute of Electrical and Electronics Engineers, Incorporated is distributing this Article with permission of the International Business Machines Corporation (IBM) who is the exclusive owner. The recipient of this Article may not assign, sublicense, lease, rent or otherwise transfer, reproduce, prepare derivative works, publicly display or perform, or distribute the Article.  

Published in:

IBM Journal of Research and Development  (Volume:53 ,  Issue: 1 )