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In this paper, we develop a low-cost manufacturing technology for RF system-in-package applications. This high-performance process technology for integrated passive devices is achieved by electroplated formed thick Cu metal trace and back-side substrate thinning process on 8-inch glass wafer. This paper first presents investigations for common integration of inductors, resistors, capacitors in this thin film process technology and examines their RF performance. Then, a lowpass filter design for 2.4 GHz ISM band application is also demonstrated. Good RF performance as well as small form factor are achieved.