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Design and fabrication of passive components using TF-IPD technology

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3 Author(s)
Tsaitzu Lee ; Touch Micro-Syst. Technol. Corp., Yangmei, Taiwan ; Yo-Shen Lin ; Chiajiun Chen

In this paper, we develop a low-cost manufacturing technology for RF system-in-package applications. This high-performance process technology for integrated passive devices is achieved by electroplated formed thick Cu metal trace and back-side substrate thinning process on 8-inch glass wafer. This paper first presents investigations for common integration of inductors, resistors, capacitors in this thin film process technology and examines their RF performance. Then, a lowpass filter design for 2.4 GHz ISM band application is also demonstrated. Good RF performance as well as small form factor are achieved.

Published in:

Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International

Date of Conference:

21-23 Oct. 2009