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Aging effects on interfacial reactions between Cu addition into the Sn-9Zn lead-free solder and Au substrate

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3 Author(s)
Wei-Kai Liou ; Graduate Institute of Materials Science and Technology, National Taiwan University of Science and Technology, No. 43, Sec.4, Keelung Rd., Taipei, 10672, Taiwan, ROC ; Yee-Wen Yen ; Chien-Chung Jao

This study investigates aging effects on interfacial reactions between Sn-9wt%Zn-x wt% (SZ-xCu) alloys and Au substrate. The Au3Zn7/AuZn2/AuZn and Au3Zn7/AuZn phases respectively formed in the SZ/Au and SZ-1Cu/Au couples aged at 160°C for 24 hours. Only the AuSn phase was found at the SZ-4 Cu/Au interface. Extending the aging time to 800 hours, Sn became a dominant diffusion element. Binary Au-Sn phases and the metastable Au-Zn-Sn ternary phase, Au33-36 Zn35-36Sn29-31, was formed at the interface. The aging effect causing the changes of dominant diffusion element and concentration of Zn, Cu in the solder is the main reasons to change the sequence of the IMC formation in the SZ-xCu/Au systems.

Published in:

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference

Date of Conference:

21-23 Oct. 2009