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Evaporation cooling of high power electronic devices

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3 Author(s)
Dulnev, G.N. ; Inst. of Precision Mech. & Opt., St. Petersburg, Russia ; Korablyev, V.A. ; Sharkov, A.V.

This paper presents the problems of choosing heat transfer devices with good heat dissipating ability under boiling, as well as their utilization for cooling power semiconductor devices, for example, diodes, transistors, and thyristors. The experimental investigation of heat transfer crisis in cooling channels under the forced movement of dielectric coolant was carried out

Published in:

Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on  (Volume:19 ,  Issue: 3 )