By Topic

A rational formulation of thermal circuit models for electrothermal simulation. I. Finite element method [power electronic systems]

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Jia Tzer Hsu ; Dept. of Aerosp. Eng., Mech. & Eng. Sci., Florida Univ., Gainesville, FL, USA ; L. Vu-Quoc

As the size of the semiconductor devices is getting smaller with advanced technology, self-heating effects in power semiconductor devices are becoming important. An electrothermal simulation of complete power electronic systems that include Si chips, thermal packages, and heat sinks is essential for an accurate analysis of the behavior of these systems. This paper presents a rational approach to construct thermal circuit networks equivalent to a discretization of the heat equation by the finite element method. Elemental thermal circuit networks are developed, which correspond to the linear and cubic Hermite elements in the 1-D case, to the triangular and rectangular elements in the 2-D case, and to the tetrahedral and cube elements in the 3-D case. These thermal circuit networks are to be connected to the electrical networks of power electronic systems to provide complete electrothermal models that can be conveniently used in any circuit simulator package. Verification examples are presented to demonstrate the accuracy of the proposed formulation

Published in:

IEEE Transactions on Circuits and Systems I: Fundamental Theory and Applications  (Volume:43 ,  Issue: 9 )