Thermal modeling for 3D-ICs with integrated microchannel cooling

Integrated microchannel liquid-cooling technology is envisioned as a viable solution to alleviate an increasing thermal stress imposed by 3D stacked ICs. Thermal modeling for microchannel cooling is challenging due to its complicated thermal-wake effect, a localized temperature wake phenomenon downstream of a heated source in the flow. This paper presents a fast and accurate thermal-wake aware thermal model for integrated microchannel 3D ICs. Validation results show the proposed thermal model achieves more than 400x speed up and only 2.0% error in comparison with a commercial numerical simulation tool. We also demonstrate the use of the proposed thermal model for thermal optimization during the IC placement stage. We find that due to the thermal-wake effect, tiles are placed in the descending order of power magnitude along the flow direction. We also find that modeling thermal-wakes is critical for generating a thermal-aware placement for integrated microchannel-cooled 3D IC. It could result in up to 25˚C peak temperature difference according to our experiments. Categories and Subject Descriptors B.7.2 [Integrated Circuits]: Design Aids General Terms Design, Performance