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Thermal modeling for 3D-ICs with integrated microchannel cooling

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3 Author(s)
Hitoshi Mizunuma ; Department of Computer Science and Information Engineering, National Taiwan University ; Chia-Lin Yang ; Yi-Chang Lu

Integrated microchannel liquid-cooling technology is envisioned as a viable solution to alleviate an increasing thermal stress imposed by 3D stacked ICs. Thermal modeling for microchannel cooling is challenging due to its complicated thermal-wake effect, a localized temperature wake phenomenon downstream of a heated source in the flow. This paper presents a fast and accurate thermal-wake aware thermal model for integrated microchannel 3D ICs. Validation results show the proposed thermal model achieves more than 400¿¿ speed up and only 2.0% error in comparison with a commercial numerical simulation tool. We also demonstrate the use of the proposed thermal model for thermal optimization during the IC placement stage. We find that due to the thermal-wake effect, tiles are placed in the descending order of power magnitude along the flow direction. We also find that modeling thermal-wakes is critical for generating a thermal-aware placement for integrated microchannel-cooled 3D IC. It could result in up to 25¿¿C peak temperature difference according to our experiments.

Published in:

2009 IEEE/ACM International Conference on Computer-Aided Design - Digest of Technical Papers

Date of Conference:

2-5 Nov. 2009