By Topic

Integration of Grid Array Antenna in Chip Package for Highly Integrated 60-GHz Radios

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Mei Sun ; Institute for Infocomm Research, Singapore ; Y. P. Zhang ; Y. X. Guo ; K. M. Chua
more authors

A grid array antenna integrated in a thin cavity-down ceramic ball grid array (CBGA) package in low-temperature cofired ceramic (LTCC) technology is reported. The grid array antenna, intended for use in highly integrated 60-GHz radios, has achieved good matching (|S11| ?? -10 dB) and directional patterns from 57 to 64 GHz as well as high gain with the peak value of 13.5 dBi at 60 GHz.

Published in:

IEEE Antennas and Wireless Propagation Letters  (Volume:8 )