Scheduled System Maintenance:
On Wednesday, July 29th, IEEE Xplore will undergo scheduled maintenance from 7:00-9:00 AM ET (11:00-13:00 UTC). During this time there may be intermittent impact on performance. We apologize for any inconvenience.
By Topic

Modeling of sound-structure interaction in a rectangular enclosure using finite element method

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Mohamady, S. ; Fac. of Electr. & Electron. Eng., Univ. Putra Malaysia, Serdang, Malaysia ; Montazeri, A. ; Ahmad, R.K.R.

In this paper the effect of periodic noise traveling into a rectangular enclosure is simulated using finite element technique using COMSOL Multiphysics software. The acoustic wave which is generated by a point source outside an enclosure propagates through the enclosure wall and excites the flexible panel which is mounted on the enclosure. The behavior of transmission of sound into the cavity is investigated by computing the modal characteristics of the cavity. Base on the model proposed, simulation part is conducted to examine the natural frequency response of system as well as to compute the distortion effect of the structure response and the acoustic pressure observed within the enclosure. The simulation results were compared with previous experimental and analytical works for validation and a good match between them were obtained.

Published in:

Industrial Electronics & Applications, 2009. ISIEA 2009. IEEE Symposium on  (Volume:2 )

Date of Conference:

4-6 Oct. 2009